Experts on pgm-based innovations in high-speed laminates descended on County Durham in the UK this week to present their latest findings, pcb007.com reports.

The Institute of Circuit Technology's Darlington Evening Seminar took place on Tuesday (3rd November) and welcomed speakers from Scotland, Germany and Japan.

Andreas Gross, from Umicore Galvanotechnik, discussed the merits of multifunctional electroless nickel-palladium-gold conductor finishes for soldering and wire-bonding purposes.

He explained that placing a very thin layer of either immersion or electroless palladium between the other two metals could prevent nickel diffusing to the surface after soldering.

Furthermore, Mr Gross noted that the electroless nickel, immersion palladium and immersion gold approach is a cost-effective finish which has been rubber-stamped for mass production in Europe.

Meanwhile, Hiroshi Otake, from Uyemura in Japan, gave a presentation about an innovation devised by his company in relation to the electroless palladium process.

It designed a new additive which can maintain levels of palladium chelate, while also cutting the decrease in deposition rate over extended periods of time and improving bath stability.

Mr Otake explained that this modified chemistry is conducive to strong adhesion of the palladium deposit, even if the electroless nickel surface was left to become increasingly oxidised.

Last month, the Institute of Circuit Technology also held a successful seminar in Arundel, West Sussex.

Source:

Institute of Circuit Technology's Darlington Seminar a Success (05/11/09)

CHRIS BRYANT

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