Research and development carried out by Shin-Etsu Silicones of America has led to the roll-out of a new line of die-bond materials.

The Shin-Etsu KER Series is a "diverse line of silicone die-bond materials that provide advanced encapsulating performance for high-brightness LEDs (HBLED)".

Central to the new KER Series is the heat cured platinum catalyst which enables the methyl silicone-based system to harden.

This in turn ensures improved long-term reliability when used in applications such as general-purpose lighting and the HBLED category.

Developments such as these have helped LEDs to buck the trend within the wider electronics component industry.

"In the midst of sharp revenue declines in most electronics component categories, LEDs provide a rare growth opportunity as improvements in luminance and the applications of LEDs are rapidly expanding," Shin-Etsu confirmed.

The Shin-Etsu KER Series is made up of the KER-300-M2, KER-3100-U2 and KER-3200-T1.

Shin-Etsu products are also used in healthcare, automotive and aerospace applications.

Source:

Bonded by the light: Shin-Etsu Silicones develops high-reliability die-bonding materials for array of high-brightness (HB) LED packaging applications (10/09/09)

Ÿ Adfero Ltd